Equipment use:Suitable for medium and large size soft-to-soft and soft-to-hard lamination, commonly used for ITO film, metal grid conductive film, nano silver conductive film, AG film, naked eye 3D grating film, etc., and OCA and glass cover.

Equipment use:It is suitable for soft-to-soft and soft-to-hard bonding of large-size ITO film, metal mesh conductive film, nano silver conductive film, AG film, naked eye 3D grating film, etc. with OCA and glass cover.

Equipment use:This equipment is suitable for soft-to-hard and soft-to-soft lamination of large-size (1220-690~2300*1600) glass, optical adhesive OCA and conductive film Film.

Equipment use:It is suitable for medium and large size G+G and full lamination of hot melt adhesive processes such as SCA/OCF; it can also be used for hard-to-hard lamination of sizes in OCA process.