It is suitable for soft-to-soft and soft-to-hard bonding of large-size ITO film, metal mesh conductive film, nano silver conductive film, AG film, naked eye
3D grating film, etc. with OCA and glass cover.

1. Adopt the reverse stick structure to ensure no bubbles at the tail.

2. Adopt special roller structure to ensure no indentation at the starting position.

3. CCD vision images take pictures, and the three-axis UVW platform controlled by servo motor automatically aligns.

4. Both edge grabbing and mark grabbing can realize automatic alignment, which has a wide range of applications.

5. Enhance the suction power of the flipping platform to achieve soft-to-soft and soft-to-hard compatibility.

6. The equipment adopts Japanese SMC starter components and high-precision moving parts, with stable operation and high fitting accuracy.